Publication detail
Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition
NAVRÁTILOVÁ, L. PANTĚLEJEV, L. MAN, O. KUNZ, L.
Czech title
MIkrostrukturní stabilita ultra-jemnozrnné Cu po únavovém zatěžování a teplotní expozici
English title
Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition
Type
conference paper
Language
en
Original abstract
The objective of the present work was to study the stability of microstructure of ultra fine-grained (UFG) copper under high-cycle and very high-cycle fatigue loading and under thermal exposition. UFG Cu was prepared by equal channel angular pressing. No grain coarsening was observed after fatigue resulting in failure in the interval from 104 to 1010 cycles. Similarly, no grain coarsening was detected after thermal exposition at a temperature of 180 C for 6 min. The microstructure was examined by electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM)
Czech abstract
Cílem této práce byla studie mikrostrukturní stability ultra-jemnozrnné Cu v oblasti vysokocyklové i gigacyklové únavy a stabilita po teplotní expozici. UFG Cu připravená ECAP procesem nevykazovala krubnutí zrna v důsledku únavového zatěžování, které vedlo k poručení vzorku v rozsahu 104 až 1010 cyklů. Hrubnutí zrna nebylo pozorováno ani po teplotní expozici při 180 C s 6 min výdrží na teplotě. Mikrosruktura byla hodnocena pomocí TEM a EBSD analýzy.
English abstract
The objective of the present work was to study the stability of microstructure of ultra fine-grained (UFG) copper under high-cycle and very high-cycle fatigue loading and under thermal exposition. UFG Cu was prepared by equal channel angular pressing. No grain coarsening was observed after fatigue resulting in failure in the interval from 104 to 1010 cycles. Similarly, no grain coarsening was detected after thermal exposition at a temperature of 180 C for 6 min. The microstructure was examined by electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM)
Keywords in Czech
UFG Cur, ECAP, mikrostrukturní stabilita , EBSD
Keywords in English
UFG copper, ECAP, stability of microstructure, EBSD
RIV year
2009
Released
22.06.2009
Publisher
University of Žilina
Location
Žilina, Sk
ISBN
978-80-554-0042-6
Book
Proceedings Transcom 2009
Edition number
1
Pages from–to
149–154
Pages count
6
BIBTEX
@inproceedings{BUT33240,
author="Lucie {Navrátilová} and Libor {Pantělejev} and Ondřej {Man} and Ludvík {Kunz},
title="Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition",
booktitle="Proceedings Transcom 2009",
year="2009",
month="June",
pages="149--154",
publisher="University of Žilina",
address="Žilina, Sk",
isbn="978-80-554-0042-6"
}