Publication detail

FE modelling and analysis of the solder connections for the research project A7.11

ŠEVEČEK, O.

English title

FE modelling and analysis of the solder connections for the research project A7.11

Type

Summary research report

Language

en

Original abstract

FE simulations of the solder connections of electronic parts under different operating and testing boundary conditions (tensile and thermal tests); Investigations of the the critical regions in the solder joint where potential final failure of the joint can occur and subsequent comparision of the simulation results with experimental observations.

Keywords in English

FE model; solder joint; creep behaviour; tensile test

Released

2014-08-20

Pages count

19

BIBTEX


@misc{BUT113398,
  author="Oldřich {Ševeček}",
  title="FE modelling and analysis of the solder connections for the research project A7.11",
  year="2014",
  pages="19",
  note="Summary research report"
}