Publication detail
Study of stress distribution around an orthotropic bi-material notch tip
KLUSÁK, J. PROFANT, T. KOTOUL, M.
Czech title
Study of stress distribution around an orthotropic bi-material notch tip
English title
Study of stress distribution around an orthotropic bi-material notch tip
Type
journal article - other
Language
en
Original abstract
The analysis addresses a typical failure development pattern in thin films consisting of a system of multiple surface cracks leading to and branching along or near the interface between the film and the base material. The process is driven by thermal residual stresses and/or mechanical loading.
Czech abstract
The analysis addresses a typical failure development pattern in thin films consisting of a system of multiple surface cracks leading to and branching along or near the interface between the film and the base material. The process is driven by thermal residual stresses and/or mechanical loading.
English abstract
The analysis addresses a typical failure development pattern in thin films consisting of a system of multiple surface cracks leading to and branching along or near the interface between the film and the base material. The process is driven by thermal residual stresses and/or mechanical loading.
Keywords in Czech
Multiple cracks, Surface layer, Interface,Thermal stresses, Matched asymptotic expansions, Reciprocal theorem
Keywords in English
Genaral stress singularities, composite materials, orthotropic bi-material notch
RIV year
2009
Released
14.07.2009
Publisher
Trans Tech Publications Ltd.
Location
Holandsko
ISSN
1013-9826
Journal
Key Engineering Materials
Volume
417-418
Number
1
Pages from–to
385–388
Pages count
4
BIBTEX
@article{BUT47568,
author="Jan {Klusák} and Tomáš {Profant} and Michal {Kotoul},
title="Study of stress distribution around an orthotropic bi-material notch tip",
journal="Key Engineering Materials",
year="2009",
volume="417-418",
number="1",
month="July",
pages="385--388",
publisher="Trans Tech Publications Ltd.",
address="Holandsko",
issn="1013-9826"
}