Publication detail

Study of stress distribution around an orthotropic bi-material notch tip

KLUSÁK, J. PROFANT, T. KOTOUL, M.

Czech title

Study of stress distribution around an orthotropic bi-material notch tip

English title

Study of stress distribution around an orthotropic bi-material notch tip

Type

journal article - other

Language

en

Original abstract

The analysis addresses a typical failure development pattern in thin films consisting of a system of multiple surface cracks leading to and branching along or near the interface between the film and the base material. The process is driven by thermal residual stresses and/or mechanical loading.

Czech abstract

The analysis addresses a typical failure development pattern in thin films consisting of a system of multiple surface cracks leading to and branching along or near the interface between the film and the base material. The process is driven by thermal residual stresses and/or mechanical loading.

English abstract

The analysis addresses a typical failure development pattern in thin films consisting of a system of multiple surface cracks leading to and branching along or near the interface between the film and the base material. The process is driven by thermal residual stresses and/or mechanical loading.

Keywords in Czech

Multiple cracks, Surface layer, Interface,Thermal stresses, Matched asymptotic expansions, Reciprocal theorem

Keywords in English

Genaral stress singularities, composite materials, orthotropic bi-material notch

RIV year

2009

Released

14.07.2009

Publisher

Trans Tech Publications Ltd.

Location

Holandsko

ISSN

1013-9826

Journal

Key Engineering Materials

Volume

417-418

Number

1

Pages from–to

385–388

Pages count

4

BIBTEX


@article{BUT47568,
  author="Jan {Klusák} and Tomáš {Profant} and Michal {Kotoul},
  title="Study of stress distribution around an orthotropic bi-material notch tip",
  journal="Key Engineering Materials",
  year="2009",
  volume="417-418",
  number="1",
  month="July",
  pages="385--388",
  publisher="Trans Tech Publications Ltd.",
  address="Holandsko",
  issn="1013-9826"
}