Publication detail
Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method
KARIMI-SIBAKI, E. VAKHRUSHEV, A. WU, M. LUDWIG, A. BOHÁČEK, J. KHARICHA, A.
English title
Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method
Type
journal article in Web of Science
Language
en
Original abstract
A numerical model utilizing the volume of fluid (VOF) method is proposed to simulate the transient shape changes of the deposit front, considering the diffusion-limited electrodeposition process. Modeling equations are proposed to accurately handle transport phenomena in both electrolyte (fluid) and deposit (solid). Transient evolutions of field structures, including flow, concentration, electric current density, and electric potential, are computed considering electrodeposited copper bumps. Two cases, including single cavity and multiple cavities, are studied. Based on the modeling results, the maximum height of the hump and the thickness of the deposited layer in each consecutive cavity decreases going from upstream to downstream. Conversely, the location of the maximum height of the hump remains unchanged in all cavities. Results are validated against available experiments.
English abstract
A numerical model utilizing the volume of fluid (VOF) method is proposed to simulate the transient shape changes of the deposit front, considering the diffusion-limited electrodeposition process. Modeling equations are proposed to accurately handle transport phenomena in both electrolyte (fluid) and deposit (solid). Transient evolutions of field structures, including flow, concentration, electric current density, and electric potential, are computed considering electrodeposited copper bumps. Two cases, including single cavity and multiple cavities, are studied. Based on the modeling results, the maximum height of the hump and the thickness of the deposited layer in each consecutive cavity decreases going from upstream to downstream. Conversely, the location of the maximum height of the hump remains unchanged in all cavities. Results are validated against available experiments.
Keywords in English
SHAPE EVOLUTION; COPPER; DEPOSITION; BUMPS; MODEL
Released
04.07.2023
Publisher
ELECTROCHEMICAL SOC INC
Location
PENNINGTON
ISSN
0013-4651
Volume
170
Number
7
Pages from–to
1–6
Pages count
6
BIBTEX
@article{BUT184760,
author="Ebrahim {Karimi-Sibaki} and Alexander {Vakhrushev} and Menghuai {Wu} and Andreas {Ludwig} and Jan {Boháček} and Abdellah {Kharicha},
title="Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method",
year="2023",
volume="170",
number="7",
month="July",
pages="1--6",
publisher="ELECTROCHEMICAL SOC INC",
address="PENNINGTON",
issn="0013-4651"
}