Publication detail

Thermal conductivity of Cu7.2Ni1.8Si1Cr Copper alloy produced via SLM and ability of thin-wall structure fabrication

MAŠEK, J. KOUTNÝ, D. POPELA, R.

Czech title

Tepelná vodivost slitiny mědi Cu7.2Ni1.8Si1Cr vyrovené metodou SLM a možnost výroby tenkých stěn

English title

Thermal conductivity of Cu7.2Ni1.8Si1Cr Copper alloy produced via SLM and ability of thin-wall structure fabrication

Type

conference paper

Language

en

Original abstract

Selective Laser Melting (SLM) as part of the Additive manufacturing industry is a metal printing technology that is considered promising to address the thermal integrity defects of a Heat Switch – the space technology currently under development. However, no thermal conductivity data of SLMed copper alloy Cu7.2Ni1.8Si1Cr are freely available. Therefore, three parts were fabricated and tested in an experimental thermo-vacuum chamber to reveal the material thermal conductivity. The samples analogous to the Heat Switch components were: a disk with inner holes and two cylinders with thin-wall web of 0.325 mm and 1.625 mm. Based on the previous experience with the copper alloy, fabrication was successfully processed with up to 5 % dimensional accuracy according to CAD model. The thermal conductivity evaluation process was improved by the implementation of heat transfer by radiation and the calculated thermal conductivity of SLMed Cu7.2Ni1.8Si1Cr was 3.4 times lower than the value of bulk material AMPCOLOY 944 with a similar chemical composition.

English abstract

Selective Laser Melting (SLM) as part of the Additive manufacturing industry is a metal printing technology that is considered promising to address the thermal integrity defects of a Heat Switch – the space technology currently under development. However, no thermal conductivity data of SLMed copper alloy Cu7.2Ni1.8Si1Cr are freely available. Therefore, three parts were fabricated and tested in an experimental thermo-vacuum chamber to reveal the material thermal conductivity. The samples analogous to the Heat Switch components were: a disk with inner holes and two cylinders with thin-wall web of 0.325 mm and 1.625 mm. Based on the previous experience with the copper alloy, fabrication was successfully processed with up to 5 % dimensional accuracy according to CAD model. The thermal conductivity evaluation process was improved by the implementation of heat transfer by radiation and the calculated thermal conductivity of SLMed Cu7.2Ni1.8Si1Cr was 3.4 times lower than the value of bulk material AMPCOLOY 944 with a similar chemical composition.

Keywords in Czech

Aditivní výroba, výrobní přesnost metody SLM, slitina mědi Cu7.2Ni1.8Si1Cr, struktura tenkých stěn, testování tepelné vodivosti

Keywords in English

Additive manufacturing, SLM production accuracy, Copper alloy Cu7.2Ni1.8Si1Cr, Thin-wall structures, Thermal conductivity testing

Released

20.12.2018

Publisher

Brno University of Technology

Location

READ 2018, Brno, ČR

ISBN

978-80-214-5696-9

Book

13th Research and Education in Aircraft Design Conference

Pages from–to

119–129

Pages count

11

BIBTEX


@inproceedings{BUT151321,
  author="Jakub {Mašek} and Daniel {Koutný} and Robert {Popela},
  title="Thermal conductivity of Cu7.2Ni1.8Si1Cr Copper alloy produced via SLM and ability of thin-wall structure fabrication",
  booktitle="13th Research and Education in Aircraft Design Conference
",
  year="2018",
  month="December",
  pages="119--129",
  publisher="Brno University of Technology",
  address="READ 2018, Brno, ČR",
  isbn="978-80-214-5696-9"
}