Detail publikace

Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces

BOCCACCINI, D. ŠEVEČEK, O. et al.

Anglický název

Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces

Typ

Článek WoS

Jazyk

en

Originální abstrakt

The determination of the bonding strength (BS) between solid oxide cell (SOC) electrodes and metal interconnects (IC) is of importance since it can impact the SOC lifetime. There are several methods for determining the adhesion between ceramic and metal layers at the macro-scale level, but no standard technique for such measurement is available. In this work, the BSs between an anode support (AS) and three different cathodes with a SOC interconnect were tested in three point bending test configuration. An adaptation of the Schwickerath crack initiation test (SCIT) (ISO 9693) was used to verify its applicability for the determination of bonding strength in the interfaces. The results suggest that this test is a valid method for the mechanical characterization of SOC interfaces.

Klíčová slova anglicky

Schwickerath crack-initiation test; three-point bending test; SOC interfaces; metal-ceramic bond strength

Vydáno

2016-01-01

Nakladatel

Elsevier

Místo

Holandsko

ISSN

0167-577X

Ročník

2015

Číslo

162

Strany od–do

250–253

Počet stran

4

BIBTEX


@article{BUT116748,
  author="D. N. {Boccaccini} and Oldřich {Ševeček}",
  title="Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces",
  journal="MATERIALS LETTERS",
  year="2016",
  volume="2015",
  number="162",
  pages="250--253",
  doi="10.1016/j.matlet.2015.07.137",
  issn="0167-577X",
  url="http://www.sciencedirect.com/science/article/pii/S0167577X15303293"
}